Process Technology

SMT Process

SMT (Surface Mount Technology), also known as surface mount technology, refers to a technology that mounts electronic components such as resistors, capacitors, transistors, and volume circuits on the surface of a circuit board (PCB), mainly through solder paste. Paste) is printed on the circuit board that needs to be soldered, put on the electronic components, use high temperature to melt the solder paste, let the solder paste cover the electronic components, and after the temperature cools down and become solid, the surface soldering is completed.

The SMT industry has recently developed its system integration of functions such as intelligence in the whole process, timely visualization of information, and intelligent warehousing and logistics (AGV). With the advancement of science and technology, the degree of automation of SMT equipment technology has become higher and higher, labor costs have been greatly reduced, and personal output has been greatly improved. The main theme of the future development of SMT technology will develop towards high performance, high flexibility, ease of use and green energy and environmental protection.
  

Specifications

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